Board-Level Multi-Cavity Shielding

When it comes to developing technology and electronics, more complex designs and products have been used, resulting in teams dedicated to controlling the RF factor, the design of the circuits, decrease the size of the product, and ensure that there is space for growth while reducing the cost of production. Because of these developments, it has become necessary to provide shields for electronics to protect these electronics from outside disturbances. Therefore, research and development teams have developed labyrinth and lid shielding assemblies. There are alternatives to lid shielding, one approach being a multitude of individual shielding cans, or using one solid material – like aluminium. When it comes to using multiple cans, it becomes disadvantageous because the product becomes bigger and bulkier – you need space in between the cans for springs and other lid fixings. However, when a solid material is used to create a labyrinth, then the connection may not be as effective.

One useful method of creating a screening, or an enclosure, is to use photo-chemical machining (PCM), which is a method that is advantageous to the engineer and the manufacturer. This method uses inexpensive photo-tooling created from CAD information provided by the customer. This process is advantageous because it allows the possibility of rapid change without considerable expense. The design process includes the basic outline, fold lines, and location tags – which can be manufactured without the use of special tools.
PCM, as a method, uses chemicals in place of hard cutting tools – resulting in a process that produces complex profiles with accuracy, using a variety of sheet metals like copper, steel, aluminium, brass, or nickel-silver. Another advantage to PCM is that it uses part-etching to produce fold lines, allowing the engineer to be able to fold the shield, rather than have seamed joints. This method of part-etching can also be used to provide logos, identification numbers, or channels for inserted sealing material – with no extra production cost.
When it comes to choosing the base material, it is important to look at the type and frequency of the radiated signal that the shield is meant to deflect. If you are planning to create a shield for high frequencies, then the use of non-ferrous material is recommended. However, if you are planning to shield against magnetic interference and low frequencies, then a ferrous material would be preferred.
When it comes to finishing the shield, plating finishes are necessary to prevent oxidation, and to increase surface conductivity and assists in radiation reflection.

3G Shielding has been creating top-quality electronic shields since 1994 and have been one of the leading companies in the market. 3G is a service-oriented enterprise and is focused on providing their global clientele with excellent products and excellent service. The company is successful because of their strong worth ethic and an ability to maintain quality at all times. The company focuses on satisfying client needs, which means that the company will be able to produce specific board shielding, enclosure shielding, microwave absorbers, and thermal solutions – no matter what your shielding need may be, 3G Shielding will be able to provide.

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